Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints 中文
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/underfill-evolution
: • The Underfill Volume and Tolerance Calculator • Understanding cause and effect in the underfill process Get Your Handbook Back To Top ASYMTEK supplies automated fluid dispensing and conformal coating systems that are backed by a global support network
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
. Can you give me some background on this issue, as we are trying to determine the root cause of... Question: We are having certain batches of PC boards exhibiting micro voiding at the copper-lead free intermetallic region after thermal stress
| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
. Can you give me some background on this issue, as we are trying to determine the root cause of this problem? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/soldering-processes/process-troubleshooting-guide
flux chemistries, different solder alloys and individual selective soldering machine configurations. The purpose of the Nordson SELECT TH Soldering Troubleshooting Guideline is to provide a cause and effect matrix of through-hole soldering process parameters that have a direct bearing on the quality
FKN Systek | http://fknsystek.com/8DSK3000.pdf
. By offsetting the circular blade of the K3000 slightly and bringing it down past the linear blade to cause a shearing effect, it is possible to use the K3000 to singulate these panels with relative ease
FKN Systek | https://fknsystek.com/8DSK3000.pdf
. By offsetting the circular blade of the K3000 slightly and bringing it down past the linear blade to cause a shearing effect, it is possible to use the K3000 to singulate these panels with relative ease
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Humidity – Moisture has increasingly become one of the biggest issues for printed circuit board manufacturers today. Aside from the popcorn effect and microscopic cracking, it can also cause solder balls to form due to escaping air or water
| http://etasmt.com/cc?ID=te_news_industry,24164&url=_print
has been gradually phased out. In the lead-free solder, need to focus on the heat transfer effect. Especially for the large heat capacity of the original device, if you can not obtain a sufficient heat transfer will cause the rate of temperature increase significantly lagged behind the small heat
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