Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
| http://etasmt.com:9060/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
| http://etasmt.com/te_news_industry/2021-08-31/23964.chtml
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/wp-content/uploads/2014/09/eptac_09_17_14.pdf
| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components
. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor
