ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/zone-shear
. This test results in the first row of bonds create a peeling action on the next row of bonds throughout the duration of the test. The shear height is actively controlled during the test using an intelligent loadtool landing and stepback system and the fixturing allows for sample planarity and co planarity adjustment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/about-us/news/nordson-dima-at-apex-2019
. Thermode/hot bar design offers an easy, fast, and reliable exchange of thermodes and ensures co-planarity of solder joints. The programmable automated flux dispensing process with constant fluid dispense volumes contributes to consistent product quality
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/zone-shear?con=t&page=8
. This test results in the first row of bonds create a peeling action on the next row of bonds throughout the duration of the test. The shear height is actively controlled during the test using an intelligent loadtool landing and stepback system and the fixturing allows for sample planarity and co planarity adjustment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/zone-shear?con=t&page=5
. This test results in the first row of bonds create a peeling action on the next row of bonds throughout the duration of the test. The shear height is actively controlled during the test using an intelligent loadtool landing and stepback system and the fixturing allows for sample planarity and co planarity adjustment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/zone-shear?con=t&page=4
. This test results in the first row of bonds create a peeling action on the next row of bonds throughout the duration of the test. The shear height is actively controlled during the test using an intelligent loadtool landing and stepback system and the fixturing allows for sample planarity and co planarity adjustment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/zone-shear?con=t&page=3
. This test results in the first row of bonds create a peeling action on the next row of bonds throughout the duration of the test. The shear height is actively controlled during the test using an intelligent loadtool landing and stepback system and the fixturing allows for sample planarity and co planarity adjustment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types/zone-shear?con=t&page=2
. This test results in the first row of bonds create a peeling action on the next row of bonds throughout the duration of the test. The shear height is actively controlled during the test using an intelligent loadtool landing and stepback system and the fixturing allows for sample planarity and co planarity adjustment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/news/meet-with-the-nordson-yestech-team-smtai-for-a-demonstration-on-the-fx-940-ultra-3d-aoi
. The YESTECH team will demonstrate the FX-940 ULTRA 3D AOI with cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-brings-its-flagship-inspection-systems-to-smtai
. The Nordson YESTECH FX-940 ULTRA 3D AOI with cutting-edge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/discover-leading-test-and-inspection-platforms-from-nordson-at-smtai
. The Nordson YESTECH FX-940 Automated Optical Inspection (AOI) offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part / polarity, through-hole parts, and co
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