28 contaminated pcb results

PCB Dewetting - Heller

Heller Industries Inc. | https://hellerindustries.com/dewetting/

thin solder film and the base metal is not exposed. Process and design-related causes of PCB Dewetting: Solder paste flux not aggressive enough for level of oxidation present on part or PCB PCB pad contaminated Component lead contaminated Excessive moisture absorbed by paste Paste exposed beyond

Heller Industries Inc.

PCB Dewetting & PCB Bridging-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23572&url=_print

• PCB pad contaminated • Component lead contaminated • Excessive moisture absorbed by paste • Paste exposed beyond worklife • Ambient humidity and temperature beyond paste work envelope

PCB Dewetting & PCB Bridging-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23572.chtml

• PCB pad contaminated • Component lead contaminated • Excessive moisture absorbed by paste • Paste exposed beyond worklife • Ambient humidity and temperature beyond paste work envelope

PCB Dewetting & PCB Bridging-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23572.chtml

• PCB pad contaminated • Component lead contaminated • Excessive moisture absorbed by paste • Paste exposed beyond worklife • Ambient humidity and temperature beyond paste work envelope

PCB Nonwetting-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23573&url=_print

.   Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB • PCB pad contaminated

PCB Nonwetting-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23573.chtml

.   Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB • PCB pad contaminated

PCB Nonwetting-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23573.chtml

.   Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB • PCB pad contaminated

How to Prevent Non-Wetting Defect during the SMT Reflow Process-SMT Technical-Reflow oven,SMT Reflow

| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print

using the same reflow profile. The solder paste or flux has been contaminated. Corrective Action Pay close attention to the storage environment of PCB or the components

How to Prevent Non-Wetting Defect during the SMT Reflow Process-SMT Technical-Reflow oven,SMT Reflow

| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml

using the same reflow profile. The solder paste or flux has been contaminated. Corrective Action Pay close attention to the storage environment of PCB or the components

Assure Quick Check

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/assure-quick-check

. Ideal for looking at PCB assemblies, finished goods, cable quality and medical devices. High throughput QuickCheck's bright, high power X-ray tube and sensitive flat panel detector take images fast

ASYMTEK Products | Nordson Electronics Solutions