Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=0
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=5
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/
. PCB Specifications View Matrix Part Number * Revision Quantity * Thickness 0.062" Layers * Select One 2 4 6 8 Dimensions * Materials FR4(130Tg) Copper Weight 1 oz Finish Plating Leaded Solder Minimum Trace/Space
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=2
) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
| https://www.eptac.com/wp-content/uploads/eptac/datasheets/EPTAC_DataSheet_IPCDesigner_CID-Plus.pdf
• Board Material Properties • Plating Characteristics for Conductors and Holes • Surface Finish and Treatment Characteristics • Solder Mask/Coating Material Properties and Compatibility
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=1
. PCB Specifications View Matrix Part Number * Revision Quantity * Thickness 0.062" Layers * Select One 2 4 Dimensions * Materials FR4(130Tg) Copper Weight 1 oz Finish Plating Leaded Solder Minimum Trace/Space
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID-Plus.pdf
• Board Material Properties • Plating Characteristics for Conductors and Holes • Surface Finish and Treatment Characteristics • Solder Mask/Coating Material Properties and Compatibility
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-microvias-and-printed-circuit-boards/
. The larger this ratio is, the lower their reliability. Why is this the case? Once a hole has been made in the surface of a printed circuit board, it needs to be covered with a layer of copper plating
