Baja Bid | https://bajabid.com/precision-circuit-solutions/
: 2018 Hengli Eletek HSK2505-0611 Belt Furnace 2010 Kaeser Airbox.1 Compressor V-Tek TM-50 OEM Taping Machine Laser Trimming System 44 Trio-Tech C-103-006 Centrifuge NuArc FT26V3UPNS-4KN Flip Top Plate Maker Micro Automation Model 1006 Dicing Saw Cyberoptics LSM
| https://www.smtfactory.com/Successful-Delivery-of-Semiconductor-Production-Line-to-Malaysian-Partner-id40782427.html
. Background Our partner is a Malaysian company specializing in the Semiconductor Manufacturing Industry . They faced challenges in the process of dicing and placing semiconductor products and sought a reliable partner to address this issue
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/micro-testing-thin-die
. Micro Testing Thin Die Inorganic semiconductors are brittle and their strength is greatly affected by the presence of surface flaws created by dicing and handling
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-presents-two-papers-on-plasma-cleaning
stress reduction following wafer thinning and/or dicing. In the medical device industry plasma treatment can solve challenges due to issues with bio-compatibility, material mismatch, implant duration, ability to withstand sterilization, wettability, lubricity, and such
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
. Plating and lithography techniques can be used during front end manufacture to build bump and pillar structures. In addition, solder balls may also be placed or printed and then reflowed during back end manufacture before wafer dicing
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