Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-substrate/
. These layers alternate between dielectric material and metal foil. The majority of PCB substrate materials are mixed with an epoxy, thanks to excellent electrical performance that come from lower dielectric constants and loss tangents compared to other materials
Imagineering, Inc. | https://www.pcbnet.com/blog/fr-4-vs-rogers-material-for-manufacturing-rf-pcbs/
. Rogers materials perform best in these environments, as they have low dielectric loss and an expansive frequency range. A full list of materials, along with their dielectric constants and frequency ranges can be found here
ORION Industries | http://orionindustries.com/pdfs/SILPADA2000.pdf
. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE
ORION Industries | http://orionindustries.com/pdfs/SILPAD900S.pdf
. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE
ORION Industries | http://orionindustries.com/pdfs/silpadk10.pdf
. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE
ORION Industries | http://orionindustries.com/pdfs/PDS_GPVOS_0305E.pdf
. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE
ORION Industries | http://orionindustries.com/pdfs/PDS_GPVOUS_0305E.pdf
. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE
ORION Industries | http://orionindustries.com/pdfs/gappad.pdf
Young’s Modulus* (psi) Modulus 100 Rate 0.01 ASTM D575 Electrical Dielectric Breakdown Voltage >6 kV ASTM D149 Dielectric Constant 5.5 ASTM D150 Volume Resistivity 1011 Ohm-meter ASTM D257 Thermal Thermal Conductivity (@10 psi
ORION Industries | http://orionindustries.com/pdfs/silpad400.pdf
° to warp and fill 3 (20) 3 (20) ASTM D 412 Continuous Use Temp., °C -60 to +180 -60 to +180 -60 to +180 Specific Gravity 2.0 2.0 1.8 ASTM D 792 Construction Silicone/Fiberglass Silicone/ Fiberglass Thermal Vacuum Weight Loss
