Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/call_for_papers.cfm
: Tin whiskers Electromigration and corrosion Solder embrittlement Materials: Conformal and hydrophobic coatings Thermal interface materials Underfills and encapsulants Environmental compliance
40731 | https://www.smta.org/icehet/ICEHET-2020-Program.pdf
Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4722
) density and resistance to deleterious electromigration effects. In micro Cu-pillars, SnAg solder is electroplated on top of a Cu pillar
| https://ipcapexexpo.org/education/call-for-technical-paper-form
) Surface Reliability: sub-topics Corrosion Electromigration Objective Evidence Surface Insulation Resistance Testing (SIR) Other Topic Brief Biography
| https://ipcapexexpo.org/education/call-for-participation
) Automated X-ray Inspection (AXI) Failure Analysis In-circuit Testing (ICT) Inspection Methods Microvia Interface Failures Process Control Reliability after Repair or Rework Surface Reliability Corrosion Electromigration Objective Evidence Surface Insulation Resistance Testing (SIR
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
&D Scientist and Engineer, Sandia National Laboratories 2010 Jonathon Tucker , Purdue University (West Lafayette, IN) Paper: "Effects of Alloy Composition and Low Current Density Electromigration on Deformation Behavior of Pb-Free Solders" Where is he now
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
alloys with high reliability and reduced fragility will be presented. Electromigration and tin whisker will also be discussed. PDC07 Embedding Passive and Active Components PCB Design, Fabrication Methodologies and Assembly Process Strategy Cancelled
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
^ Best Student Paper The following paper was selected as the 2019 Best Student Paper. 2019: Faramarz Hadian, Binghamton University " Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy " View past award winners 2018: Vishnu Reddy, Georgia Tech
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
