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Circuit Board Voids & PCB Delamination-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml

• Improper solder volume due to improper stencil design • Paste viscosity too low • Paste metal content too low • Bad or expired solder paste

SolderTip #43: IPC J-STD-001 Rev. E Instructor Training Materials - EPTAC - Train. Work Smarter. Suc

| https://www.eptac.com/soldertip/soldertip-43-ipc-j-std-001-rev-e-instructor-training-materials/

: Through Hole Soldering of Thick PCBs SolderTip #38: Clean vs No-Clean Fluxes SolderTip #39: Class 2 vs Class 3 Assemblies SolderTip #40: Component Mounting and Acceptability Question

Page 6 – EPTAC – Train. Work Smarter. Succeed

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years. IPC-7711/7721 – Rework and Repair The IPC-7711/7721 , Rework of Electronic Assemblies/Repair and Modification of Printed Boards and Electronic Assemblies , details rework and repair methods of damaged or malfunctioning PCBs. Certification in this