| https://www.eptac.com/ask/ipc-a-610-revision-f-paragraph-7-3-5-1-supported-holes-solder-vertical-fill-a/
. The segment of the document that covers the section for less than 14 leads and Class 2 requirements for 50% hole fill due to inner layer heat sinking was left out of the documents, and now in this revision of both 610 and 001, that particular section is missing
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
What is the Correct Way to Fill Solder Cups - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/soldertip/soldertip-37-through-hole-soldering-of-thick-pcbs/
. More than likely, there is not enough heat or thermal capacity in the solder iron to heat the entire hole up to soldering temperatures, thereby the solder solidifies going up through the hole and that’s it, it doesn’t fill any further
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-37-through-hole-soldering-of-thick-pcbs
. More than likely, there is not enough heat or thermal capacity in the solder iron to heat the entire hole up to soldering temperatures, thereby the solder solidifies going up through the hole and that’s it, it doesn’t fill any further
| https://www.eptac.com/faqs/ask-helena-leo/ask/75-barrel-fill-requirement-for-class-2-change-in-j-std-001-revision-f
75% Barrel Fill Requirement for Class 2 Change in J-STD-001 Revision F - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/ask/75-barrel-fill-requirement-for-class-2-change-in-j-std-001-revision-f/
75% Barrel Fill Requirement for Class 2 Change in J-STD-001 Revision F - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/ask/solder-flow-near-through-hole-component-body/
Solder Flow Near Through-Hole Component Body - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| http://etasmt.com/cc?ID=te_news_industry,23962&url=_print
. Is the layout designed for the PIP process? If the PCB hole diameter is too big, it will require too much solder to fill it up. If it is too small, it is very difficult to fill the hole properly with paste during solder paste printing
| http://etasmt.com:9060/te_news_industry/2021-08-31/23962.chtml
. Is the layout designed for the PIP process? If the PCB hole diameter is too big, it will require too much solder to fill it up. If it is too small, it is very difficult to fill the hole properly with paste during solder paste printing
| http://etasmt.com/te_news_industry/2021-08-31/23962.chtml
. Is the layout designed for the PIP process? If the PCB hole diameter is too big, it will require too much solder to fill it up. If it is too small, it is very difficult to fill the hole properly with paste during solder paste printing
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