| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf
| https://www.eptac.com/faqs/soldertips?hsLang=en
. Read More Gold Removal Issues with Hollow Cup Connectors General Tip Question: We are having a hard time with the removal of gold from hollow cup connectors
| https://www.eptac.com/faqs/soldertips
. Read More Gold Removal Issues with Hollow Cup Connectors General Tip Question: We are having a hard time with the removal of gold from hollow cup connectors
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
. Is this a fair assumption? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
| https://www.eptac.com/solder-tips/
. Read Answer Gold Removal Issues with Hollow Cup Connectors Question: We are having a hard time with the removal of gold from hollow cup connectors
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
within the cup to dissolve gold plating; the liquid solder can then be wicked‐out with stranded wire. b. The supplier shall degold and pretin the jointing surface of the connector body by fitting the connector to a suitable sized PTFE plug held
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
) and Gold Embrittlement Conditions David Hillman and Daphne Gates Abstract 32-3 Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA
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