81 hasl wetting tin results

Vapor Phase Soldering to Immersion Tin Plated Pads - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/

melting point of tin amounts to 231.8degC. A further solder test presented a considerable decrease in the wetting behavior after reflow aging

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf

°C N2 Good Wetting but Surface Finish Looks Grainy (Acceptable ball formation) PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 10 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 2 Tin, Silver Copper, Antimony, BGA 230

Heller Industries Inc.

Leadfree

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf

°C N2 Good Wetting but Surface Finish Looks Grainy (Acceptable ball formation) PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 10 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 2 Tin, Silver Copper, Antimony, BGA 230

Heller Industries Inc.

Aging of Sn-Ag Solder/Cu Joints, by X. DENG, G. PIOTROWSKI, J.J. WILLIAMS, and N. CHAWLA What is the Problem? 7 Copper-Tin Intermetallic 8 Wetting Angle 9 Cu6Sn5 and Cu3Sn 10 Dewetting 11 Adapted from

| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf

#1 Evaluation Parameters  Boards, HASL and OSP  Components, Tin and Tin/Lead  Solder, SAC 305 and Tin/Lead Investigation of the Forward and Backward Compatibility of Solder Alloys With Component Finishes for HASL and OSP PCB Finish, Anand Kannabiran, Elavarasan T

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

Basic Requirements for Reflow Soldering Oven-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,13161&url=_print

. Reflow soldering oven characteristics Basic requirements for reflow soldering ovne: Proper heat 2. Good wetting; 3. Proper solder joint size and shape; 4

PCB Assembly Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/

• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control

Imagineering, Inc.

PCB Fabrication Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/

• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control

Imagineering, Inc.

.   In our case a copper-tin intermetallic compound 6 Bonding Process Metal 1 Metal 2 Interface with Metals 1 & 2 e.g. Component e.g. Printed board 7 Wetting Angles 8 Equilibrium of Wetting 9 Poor Wetting And Its Causes

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_06_16_10.pdf

Basic Requirements for Reflow Soldering Oven-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2019-12-17/13161.chtml

. The reflow manufacturer ETA will analyze it in detail. Reflow soldering oven characteristics Basic requirements for reflow soldering ovne: Proper heat 2. Good wetting; 3