Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls. ♦
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
! 2010 Status of the Proliferation of Lead-Free Alloys: 2010 Ronald Lasky, Ph.D., P.E. Free! 2010 Reducing Head-in-Pillow with Tin-Lead and Lead-Free Solder Paste Development Jasbir Bath Free! 2009 Practical Guidelines for Moisture Sensitive
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
Testing Failure Analysis Techniques Flip Chip High Temperature Packaging Lead Finishes Magnetic Soldering MEMS and Sensors Moisture Sensitive Devices (MSD
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. lead-free Many applications have a requirement for use of lead-free solder alloy. Sometimes this is due to the product falling under the RoHS
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
. lead-free Many applications have a requirement for use of lead-free solder alloy. Sometimes this is due to the product falling under the RoHS
GPD Global | https://www.gpd-global.com/co_website/about-environment.php
Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam
GPD Global | https://www.gpd-global.com/about-environment.php
Nozzles Real Time Process Control (FPC) Lead Formers Lead Formers Selection Axial Lead Former Radial Lead Former Peel Force Tester Peel Back Force Tester Applications APPLICATIONS OVERVIEW Conductive Adhesive Non-Conductive Adhesive Dam
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-equipment-101-what-equipment-is-used-to-pcb-assembly/
. Usually, this consists of tin, lead, and silver. It functions as a type of glue that can hold the completed board together. Without this paste, components wouldn’t stick
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Abstract 32-2 The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ Heating Technique in the SEM Peter Banh, André M. Delhaise, Doug D. Perovic Abstract 32-2 Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I
| 1 |
