| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: Soldering gold parts onto printed circuit boards follows Paragraph 4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
. The way 001 is written, there is no exemption for surface mount components, 4.5.1b states Gold shall [N1P2D3] be removed: b. From 95% of all surface to be soldered of surface mount component regardless of gold thickness
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
: Soldering gold parts onto printed circuit boards follows Paragraph 4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
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Imagineering, Inc. | https://www.pcbnet.com/quote/assembly-quote/?cpn=0
Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-china/
Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/
) LF HASL OSP ENIG2U"-5U" (Immersion Gold), Immersion Tin, Immersion Silver from Taiwan or China Minimum Trace/Space 0.005" 0.006" 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A
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