ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/barrels/extrusion-barrels
barrel for a longer period of time Improved productivity No degradation or contamination of the process due to no seams trapping polymers
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed
)? Connectors and surface mount oscillators are only available in Gold over Nickel... Question: Why did the IPC make the gold removal requirement for Class 2 products a requirement (D2D3
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-FR/divisions/polymer-processing-systems/products/barrels/extrusion-barrels
dégradation ou contamination du procédé, car aucun joint n’emprisonne les polymères (pour les cylindres jusqu’à 6 100 mm [240”]) Xaloy X-800® Durée de service
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-FR/divisions/polymer-processing-systems/products/barrels/injection-barrels
accrue Conception monobloc du cylindre, pour les cylindres jusqu’à 6 100 mm (240”), éliminant ainsi les joints responsables de la dégradation ou de la contamination du procédé Xaloy X-800®
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/xaloy-solutions-for-splay-defects
. This cosmetic defect occurs in plastic injection molding, when silver or white streaks appear on the surface of the part face due to air, contamination, heat, moisture or shear issues
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
? Does it have a Nickel underplate? How thick is the gold plating? I’ve checked Mil-Std-883F method 2011.7 Bond Strength (Destructive Bond Pull Test
| https://www.eptac.com/faqs/ask-helena-leo
. It does not appear that it is touching the IC body, but can... Read More Maximum Limits of Solder Bath Contamination QUESTION Question
| https://www.eptac.com/blog/leaded-vs-lead-free-solder-which-is-better
. Lead-free solders typically contain a variety of different metals. Some of the components you may find in lead-free solder include tin, copper, silver, nickel and zinc
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. Over the years, much has been done to arrest the contamination of our environment with lead. These include enactment of the necessary legislation in various countries to limit the use of lead, launching of programs to effectively and efficiently recycle lead, and replacement of lead compounds
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. This paper discusses the work performed studying and comparing the Cu dissolution rates of various Pb-free alloys available on the market today. Although the use of a PCB with a nickel plated layer can reduce the occurrence of Cu dissolution, all
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