| http://www.feedersupplier.com/sale-13240697-550kg-ip2x-3-dimensional-measurement-smt-spi-machine.html
550KG IP2X 3 Dimensional Measurement SMT SPI Machine Basic Information Place of Origin: Korea Brand Name: KOH YOUNG Model Number: KY8030-3 Minimum Order Quantity: 1 Unit Price
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Brazing A method of joining metals that involves the use of a filler metal or alloy that melts over 450° C (842° F) and below the melting temperature of substrate materials
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
software also provides a measurement of the ball diameter by indicating the diameter of the longest axis of the defined ball area. This is achieved by automatically counting the number of pixels in the long axis. This measurement is calibrated against the
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
software also provides a measurement of the ball diameter by indicating the diameter of the longest axis of the defined ball area. This is achieved by automatically counting the number of pixels in the long axis. This measurement is calibrated against the
KingFei SMT Tech | http://www.smtspare-parts.com/quality-11936650-220v-50-60hz-solder-paste-inspection-table-top-3d-spi-7500-vision-ce
. Automatically find the inspection position and correct the offset through the PCB MARK; 3, measurement method: fully automatic, automatic movement manual measurement, manual movement manual measurement 4, solder paste 3D simulation map, reproduce the true appearance of solder paste
KingFei SMT Tech | https://www.smtspare-parts.com/quality-11936650-220v-50-60hz-solder-paste-inspection-table-top-3d-spi-7500-vision-ce
. Automatically find the inspection position and correct the offset through the PCB MARK; 3, measurement method: fully automatic, automatic movement manual measurement, manual movement manual measurement 4, solder paste 3D simulation map, reproduce the true appearance of solder paste
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/micro-testing-thin-die
. The 3 point bend method for the measurement of die strength is described in SEMI G86-0303. Micro bend – with a range of sample holders
| https://www.smtfactory.com/I-C-T-3D-Spi-smt-Solder-Paste-inspection-machine-I-C-T-S400-pd49143724.html
. High precision light source control technology, multiple multiple exposures. The highest measuring accuracy 0.67um. 3D compensation function With the thickness strip measurement technology of different cycles
| https://www.smtfactory.com/I-C-T-High-Speed-on-Line-3D-SPI-Solder-Paste-Inspection-Equipment-I-C-T-S400-pd49143724.html
. High precision light source control technology, multiple multiple exposures. The highest measuring accuracy 0.67um. 3D compensation function With the thickness strip measurement technology of different cycles
