ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/vision-systems
. Side Alignment Camera The side view camera is ideal for testing micro features such as copper pillars, micro bumps and TSVs. The system enables a secondary view point of feature to be tested, providing accurateand repeatable tests
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/bondtesting-systems
können die anspruchsvollsten Anwendungen wie hochdichte Löt-Bumps oder Mikro-Copper Pillars automatisch testen. Standardmäßig werden alle diese Bondtester mit linearen XY-Encodern von Reinshaw geliefert, welche die beste
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/bondtesting-systems
F ully Automated Bondtesters Our automated Bondtesters remove the need for operator intervention. They can automatically test the most demanding applications such as high density solder bumps or micro-copper pillars
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/matrix/about-us/news/introducing-the-new-nordson-matrix-planar-ct
: Densely populated and double-sided PCBAs Opposing and symmetrical BGAs Dense PoP/SiP designs Flip chips, Cu Pillars and Micro-BGAs Connectors and PTH In This Section About Us Company History News
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/matrix/technologies/3d-planar-ct
: Densely populated and double-sided PCBAs Opposing and symmetrical BGAs Dense PoP/SiP designs Flip chips, Cu Pillars and Micro-BGAs Connectors and PTH In This Section Technologies 2D - Transmission
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
. Plasma treatment can also perform etchback to expose bumps or copper pillars for WLP as well as panel-level packaging. Die Stacking Many industry leaders are developing stacked WLP to offer inexpensive alternatives to stacked bare-die packages (3D packages
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/corporate-responsibility/product-quality-and-safety
. As a member of Sedex, we commit to the four pillars of ethical trade, which are: • Health and safety; • Labor standards; • Environment; and • Business ethics. Finally, we measure the Cost of Poor Quality as one of our eight corporate Key Performance Indicators and make any adjustments to our management practices as needed
Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/call_for_papers.cfm
. We solicit your submissions in any topical area including the following: 3D/Heterogeneous Integration Build Up/Blind & Buried Via PWBs Cu Pillars
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/about-us/ascend-nbs-next
. Nordson’s Ascend strategy, which launched in 2021 and is designed to deliver market leading growth, is structured around three pillars built upon the foundation of what makes Nordson special
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/paragon-materials
. The increase in flip chip devices and the emergence of copper pillars and die stacking represents new challenges for the testing of these materials
