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How to Prevent Non-Wetting Defect during the SMT Reflow Process-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About
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How to Prevent Non-Wetting Defect during the SMT Reflow Process-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About
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. The poor wetting phenomenon usually indicates that the structure of the solder joint is not ideal, including incomplete forming of the IMC and poor solder fill
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_wave-soldering-sot23_topic995.xml
. All this information is important to us. Poor Wetting can be caused by contamination of the solder or improper solder temperature or conveyor belt moving too fast.
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. The poor wetting phenomenon usually indicates that the structure of the solder joint is not ideal, including incomplete forming of the IMC and poor solder fill
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic995&OB=ASC.html
. Now we have the problem of poor wetting. The wave soldering diection is correct. My question is also is there difference between reflow soldering footprint and the wave soldering footprint
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: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
