| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
. Can you give me some background on this issue, as we are trying to determine the root cause of this problem? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-services/training-services/on-site/
” to comply with ISO requirements Systematic focus on root cause determination and defect elimination Establishment of key performance indicators for your training program Analysis and reporting of
Blackfox Training Institute, LLC | https://www.blackfox.com/on-site-training-services/
” to comply with ISO requirements Systematic focus on root cause determination and defect elimination Establishment of key performance indicators for your training program Analysis and reporting of
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/quadra-3-x-ray-inspection-system
. For root cause failure analysis applications, and to screen for smaller defects in higher quality, choose Quadra 5 and Quadra 7 . Easily ensure IPC compliance with automatic measurement and voiding analysis that gives clear pass/fail results
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ja-JP/divisions/dage/products/x-ray-inspection-systems/quadra-3-x-ray-inspection-system
. For root cause failure analysis applications, and to screen for smaller defects in higher quality, choose Quadra 5 and Quadra 7. Easily ensure IPC compliance with automatic measurement and voiding analysis that gives clear pass/fail results
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. However, this type of removal is not effective when the root cause stems from misprinted PCBs and pre-reflow solder paste issues. As a result, it is best to diagnose the cause of solder balls as early as possible, as these processes can negatively influence your PCB manufacturing and production
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/feature-content-roll-up-page/hubert-kufner-engineers-innovation-for-nonwovens-in-luneburg-germany
. He credits the success of his innovative ventures to his commitment to finding the root cause of a problem and maintains that no one person can be greater than his or her team
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/zh-CN/divisions/dage/products/x-ray-inspection-systems/quadra-3-x-ray-inspection-system
. For root cause failure analysis applications, and to screen for smaller defects in higher quality, choose Quadra 5 and Quadra 7 . Easily ensure IPC compliance with automatic measurement and voiding analysis that gives clear pass/fail results
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_son-qfn-calculations_topic889.xml
. We were never able to conclude the root cause but it was believed to be due to center pad voiding and/or flux trapped around the perimeter of the center pad.
