41 sn-cu results

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

adding each of these above additives. In addition, both time zero analysis and ATC (0-100°C) thermal reliability analysis of the Sn-Cu + Ni solder vs. SAC405 will also be discussed. Finally, the manufacturing impact when altering the Pb-free PTH alloy will

Surface Mount Technology Association (SMTA)

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print

.  Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml

.  Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml

.  Pb also acts as a solvent metal that facilitates the formation of intermetallic bonds between the joint constituents, e.g., Sn and Cu (from the leadframe of the device package

•  In Sn-rich solders on a Cu substrate, Cu6Sn5 (η) or Cu3Sn (ε) intermetallic layers are formed at the solder/substrate interface 6 Adapted by Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution during Thermal

| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf

#3 Evaluation Parameters  Investigate solder joint reliability of SAC BGA component attached with eutectic Tin/Lead solder Solder Joint Reliability of Sn-Ag-Cu BGA Component Attached with Eutectic Pb-Sn Solder Paste, Fay Hua

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf

: contacting point of Cu and Sn; σCS: surface tension between Cu and Sn; σCF: surface tension between Cu and flux; σSF: surface tension between Sn and flux; W: Sn weight; θ

Heller Industries Inc.

:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf

:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf

Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb or In

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5454

:  Sn-Ag-Cu (SAC) solders generally have better thermal cycling performance than eutectic Sn-Pb. However, their performance deteriorates significantly as the harshness of the thermal cycle increases, and the high-Ag SAC solders that perform best in thermal cycling have relatively poor drop impact properties

Surface Mount Technology Association (SMTA)