Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
SnPb solder joints is higher than that of SAC305 solder joint because the wetting of SnPb is better than that of SnAgCu. Figure 14. Cross-section View of SnPb Solder Joint Reflowed at 215C for 90 sec. Figure 15. Cross-section View of SAC305 Solder Joint
| https://www.eptac.com/faqs/ask-helena-leo/ask/post-lead-trimming-reflow-requirements
: This following information is from Rev D of IPC-A-610. The requirement was to inspect all joints after cutting and make a determination as to whether or not the connection was damaged, then if damage was found, the solder joint was to be reflowed
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf
| http://etasmt.com/cc?ID=te_news_bulletin,14961&url=_print
. The bottom component of the large board is easily dropped during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-vs-space-addendum
: We were looking over the J-STD-001 and the Space Addendum requirements for partially visible or hidden solder connections 4.18.3. Why does the space addendum give you the option to x-ray the parts in Note D, but in the J-STD-001 book
| https://www.eptac.com/ask/j-std-001f-vs-space-addendum/
: We were looking over the J-STD-001 and the Space Addendum requirements for partially visible or hidden solder connections 4.18.3. Why does the space addendum give you the option to x-ray the parts in Note D, but in the J-STD-001 book there is no option for inspection if you
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| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf
Heller Industries Inc. | https://hellerindustries.com/white-papers-technical-articles/
& Articles White Papers Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability