53 solder joint partially reflowed results

Microsoft Word - pan_APEX06.doc

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SnPb solder joints is higher than that of SAC305 solder joint because the wetting of SnPb is better than that of SnAgCu. Figure 14. Cross-section View of SnPb Solder Joint Reflowed at 215C for 90 sec. Figure 15. Cross-section View of SAC305 Solder Joint

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Post Lead Trimming Reflow Requirements - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/post-lead-trimming-reflow-requirements

: This following information is from Rev D of IPC-A-610. The requirement was to inspect all joints after cutting and make a determination as to whether or not the connection was damaged, then if damage was found, the solder joint was to be reflowed

.  Homogeneous mixing of tin-lead paste  Granular Pb dendrites were observed on the component side of the solder joint 32 Conclusions  Percent solder joint cracking in this study was lesser for mixed assembly reflowed at 222oC compared to tin-lead assemblies

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Lead-free Reflow Soldering Machine-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

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. The bottom component of the large board is easily dropped during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems

  This is a new requirement for Class 3 products, where the solder joint must be reflowed when cutting the lead through the solder joint

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J-STD-001F vs Space Addendum - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-vs-space-addendum

: We were looking over the J-STD-001 and the Space Addendum requirements for partially visible or hidden solder connections 4.18.3. Why does the space addendum give you the option to x-ray the parts in Note D, but in the J-STD-001 book

J-STD-001F vs Space Addendum - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/j-std-001f-vs-space-addendum/

: We were looking over the J-STD-001 and the Space Addendum requirements for partially visible or hidden solder connections 4.18.3. Why does the space addendum give you the option to x-ray the parts in Note D, but in the J-STD-001 book there is no option for inspection if you

), or by other processes demonstrated to have equivalent effectiveness •  7.3.1 Termination areas shall have been "tinned" with hot-coated tin-lead solder or hot reflowed electrodeposited tin-lead solder prior to mounting the parts (Requirement

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. 3 J-STD-001Changes Between Revisions of Docs Note: •  Gold embrittled solder connections can occur regardless of gold thickness when solder volume is low or the soldering process dwell time is not sufficient to allow the gold to dissolve throughout the entire solder joint. 001 Rev E & F, Para

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Reflow Soldering Technical Papers & Articles - Heller

Heller Industries Inc. | https://hellerindustries.com/white-papers-technical-articles/

& Articles White Papers Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

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