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. A common application for this is on a BGA design where vias are commonly found in very close proximity to the BGA’s SMD pads. The concern is during assembly, solder will wick away from the intended pad and flow down the via creating poor or non-existent solder joints. Via Filling
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/pcb-via-terms-and-applications_topic1596_post6956.html
. A common application for this is on a BGA design where vias are commonly found in very close proximity to the BGA’s SMD pads. The concern is during assembly, solder will wick away from the intended pad and flow down the via creating poor or non-existent solder joints. Via Filling
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1596&OB=ASC.html
. A common application for this is on a BGA design where vias are commonly found in very close proximity to the BGA’s SMD pads. The concern is during assembly, solder will wick away from the intended pad and flow down the via creating poor or non-existent solder joints. Via Filling
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914.html
. According to the IPC-7093A you can also solder mask define the thermal pad to dam in the paste mask to prevent it from flowing into via holes
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914_post11617.html
), the solder cools before it goes all the way through the hole and out the back side. Some people are concerned about avoiding problems and they do not assume anything and pay extra to plug the via holes. The
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914_post11613.html
), the solder cools before it goes all the way through the hole and out the back side. Some people are concerned about avoiding problems and they do not assume anything and pay extra to plug the via holes. The
