| https://pcbasupplies.com/thermaltronics-m8bvf010h-bevel-60deg-1-00mm-0-04-tin-area-face-only-power-plus/
: Thermaltronics Description Additional information Description Thermaltronics M8BVF010H Bevel 60deg 1.00mm (0.04″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating
| https://pcbasupplies.com/thermaltronics-m6bvf010h-bevel-60deg-1-00mm-0-04-tin-area-face-only-power-plus/
: Thermaltronics Description Additional information Description Thermaltronics M6BVF010H Bevel 60deg 1.00mm (0.04″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating
| https://pcbasupplies.com/thermaltronics-m6bvf060h-bevel-45deg-6-00mm-0-24-tin-area-face-only-power-plus/
: Thermaltronics Description Additional information Description Thermaltronics M6BVF060H Bevel 45deg 6.00mm (0.24″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating
| https://pcbasupplies.com/thermaltronics-m8ds526h-knife-4-50mm-0-177-increased-tin-area-6-1mm-0-24-power-plus/
: Thermaltronics Description Additional information Description Thermaltronics M8DS526H Knife 4.50mm (0.177″), Increased Tin Area 6.1mm (0.24″), Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating
| https://www.eptac.com/soldertips/dealing-with-the-problems-of-soldering-iron-tips-breaking-down/
. We are soldering lead free materials between 600 and 700 degrees F and increasing the contact dwell time by about 1 to 1.5 seconds. The new lead free alloys are high in tin content and the tin will dissolve the plating on the solder iron tip and eventually eat through the tip
| https://www.eptac.com/soldertip/soldertips-dealing-with-the-problems-of-soldering-iron-tips-breaking-down/
. We are soldering lead free materials between 600 and 700 degrees F and increasing the contact dwell time by about 1 to 1.5 seconds. The new lead free alloys are high in tin content and the tin will dissolve the plating on the solder iron tip and eventually eat through the tip
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-dealing-with-the-problems-of-soldering-iron-tips-breaking-down
. We are soldering lead free materials between 600 and 700 degrees F and increasing the contact dwell time by about 1 to 1.5 seconds. The new lead free alloys are high in tin content and the tin will dissolve the plating on the solder iron tip and eventually eat through the tip