Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
] but inspecting area arrays intrinsically is difficult and quantifying void content can be equally challenging. The review of solder joint voiding by Aspandiar is a benchmark for discussion on this subject [3
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_what-is-ipc-compliance_topic2232.xml
: General Discussion : What is IPC Compliance? What is IPC Compliance? : IPC-A-610 for PCB fabrication... Author: Tom HSubject: 2232Posted: 28 Dec 2019 at 12:56pmIPC-A-610 for PCB fabrication and IPC-J-STD-001 for assembly acceptance use 3 classes to define solder joint goalacceptability for various electronic products
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/what-is-ipc-compliance_topic2232.html
. The assembly guidelines originate in the IPC-J-STD-001 standard for solder joint acceptability. The IPC Land Pattern consists of pad size and spacing and all other customization for Drafting Outlines and other preference options are not defined by IPC
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/what-is-ipc-compliance_topic2232_post9236.html
. The assembly guidelines originate in the IPC-J-STD-001 standard for solder joint acceptability. The IPC Land Pattern consists of pad size and spacing and all other customization for Drafting Outlines and other preference options are not defined by IPC
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2232&OB=ASC.html
. The assembly guidelines originate in the IPC-J-STD-001 standard for solder joint acceptability. The IPC Land Pattern consists of pad size and spacing and all other customization for Drafting Outlines and other preference options are not defined by IPC
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2232&OB=DESC.html
? Posted: 28 Dec 2019 at 12:56pm IPC-A-610 for PCB fabrication and IPC-J-STD-001 for assembly acceptance use 3 classes to define solder joint goal acceptability for various electronic products. CLASS 1
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
] but inspecting area arrays intrinsically is difficult and quantifying void content can be equally challenging. The review of solder joint voiding by Aspandiar is a benchmark for discussion on this subject [3
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
: Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys Members download articles for free: Log in now! Not a member yet
| https://www.eptac.com/faqs/ask-helena-leo/ask/inspection-criteria-for-unique-lead-geometry
: Thank you for asking what is the correct section of the IPC-A-610 to be used to inspect these solder joints, since the component termination is basically a wire
| https://www.eptac.com/ask/inspection-criteria-for-unique-lead-geometry/
. Since this lead feature is round and not flat which IPC-A-610 solder inspection criteria best fits? Answer: Thank you for asking what is the correct section of the IPC-A-610 to be used to inspect these solder joints, since the component termination is basically a wire
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