| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
: polyimide resin referred to as PI, appearance: transparent liquid, yellow powder, brown particles, amber particles polyimide resin liquid, polyimide resin solution, polyimide resin powder, polyimide Resin pellets, polyimide resin pellets
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/-/media/Files/Nordson/efd/Products/Data-Sheets/Thermal-Compound/Nordson_EFD_Thermal_Compound_Selector_Guide.pdf?la=en
: 50° C kCps 400 60 410 550 270 170 420 400 600 250 Appearance Smooth, off-white paste Dark gray paste Smooth white paste Smooth white paste Dark gray putty Smooth, gray paste Gray paste Off white paste
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/thermal-compound-selection-guide
: 50° C kCps 400 60 410 550 270 170 420 400 600 250 Appearance Smooth, off-white paste Dark Gray paste Smooth white paste Smooth white paste Dark gray putty Smooth gray paste Gray paste Off white paste
| http://etasmt.com:9060/te_news_industry/2021-10-14/26961.chtml
: polyimide resin referred to as PI, appearance: transparent liquid, yellow powder, brown particles, amber particles polyimide resin liquid, polyimide resin solution, polyimide resin powder, polyimide Resin pellets, polyimide resin pellets
| http://etasmt.com/te_news_industry/2021-10-14/26961.chtml
: polyimide resin referred to as PI, appearance: transparent liquid, yellow powder, brown particles, amber particles polyimide resin liquid, polyimide resin solution, polyimide resin powder, polyimide Resin pellets, polyimide resin pellets
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
(different from de-wetting). It is usually due to the presence of an interference layer (oxidation or contamination) on the surface to be soldered
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. This paper discusses the work performed studying and comparing the Cu dissolution rates of various Pb-free alloys available on the market today. Although the use of a PCB with a nickel plated layer can reduce the occurrence of Cu dissolution, all
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
a surface did not wet during the soldering process. Non-wetting is recognized by the fact that the bare base metal is visible (different from de-wetting). It is usually due to the presence of an interference layer (oxidation or contamination) on the
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
