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Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
SMT XTRA is a global electronics specialist, providing productivity enhancing solutions for the global Surface Mount electronic assembly sector.
Microwave Plasma System for assembly cleaning prior to wirebond, attach, encapsulation, and underfill.
Industry Directory | Manufacturer
Preco, Inc. is a premier system and manufacturing service provider for laser processing, die cutting and screen printing. It also offers reworkable underfill product that can be processed and reflowed under normal surface mount soldering assembly.
Industry Directory | Consultant / Service Provider
Expert in PCBA DFM and SMT process development (SMT/Underfill/Wave&selective soldering/ACF/Conformal&water proof coating/SMT Process tooling)
Industry Directory | Manufacturer
Axxon is the leading supplier in the field of dispensing and conformal coating systems. Target dispensing applications are flip-chip, under-fill, conformal coating, sealing, encapsulation, etc.
Industry Directory | Manufacturer
Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.
Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
Industry Directory | Manufacturer
Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.
Industry Directory | Manufacturer
Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.
Industry Directory | Consultant / Service Provider
Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)
