Technical Library | 2024-03-19 07:58:40.0
Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability.
Technical Library | 2019-06-06 00:19:02.0
More and more people and things are using electronic devices to communicate. Subsequently, many electronic products, in particular mobile base stations and core network nodes, need to handle enormous amounts of data per second. One important link in this communication chain is high speed pressfit connectors that are often used to connect mother boards and back planes in core network nodes. These new high speed pressfit connectors have several hundreds of thin, short and weak pins that are prone to damage. Small variations in via hole dimensions or hole plating thickness affect the connections; if the holes are too small, the pins may be bentor permanently deformed and if the holes are too large they will not form gas tight connections.The goal of this project was to understand how rework of these new high speed pressfit connectors affects connection strengths, hole wall deformations and plating cracks.
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
Technical Library | 2018-01-04 11:05:34.0
Traceability has grown from being a specialized need for certain safety critical segments of the industry, to now being a recognized value-add tool for the industry as a whole. The perception of traceability data collection however persists as being a burden that may provide value only when the most rare and disastrous of events take place. Disparate standards have evolved in the industry, mainly dictated by large OEM companies in the market create confusion, as a multitude of requirements and definitions proliferate. The intent of the IPC-1782 project is to bring the whole principle and perception of traceability up to date. Traceability, as defined in this standard will represent the most effective quality tool available, becoming an intrinsic part of best practice operations, with the encouragement of automated data collection from existing manufacturing systems, integrating quality, reliability, predictive (routine, preventative, and corrective) maintenance, throughput, manufacturing, engineering and supply-chain data, reducing cost of ownership as well as ensuring timeliness and accuracy all the way from a finished product back through to the initial materials and granular attributes about the processes along the way.
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
Technical Library | 2020-05-28 02:19:28.0
Properly functioning printed circuit boards are essential for both manufacturers of electronic devices and also the developers if the overall intent is for the electronic device to function at high capacity. From designing the schematics of the printed circuit boards to testing the products, there is no process of PCB manufacturing and/or assembly that can be taken for granted. While it's true that you can attempt this process on your own, especially if you are in possession of a large scale manufacturing facility, here are a few reasons why it would be a better option to opt for a professional company for PCB manufacturing and assembly. 1. Variety A professional printed circuit boards manufacturing company will be able to offer you a huge variety. You will be able to choose from rigid, flexible, or rigid-flex. What's more, the PCBs will be customized as per the need of the application. 2. Quality Professional and good printed circuit board manufacturing and assembling companies might cost you just a little bit extra but they also guarantee to produce the best results and offer very high quality products. In the end, it is quality that will make the difference between mediocre and a high functioning PCB. 3. Cost Efficiency Since you don't have to waste time or resources on buying equipment to produce the best PCBs or hiring staff to oversee the process, you can actually end up saving money. You can even save on PCB assembly cost by hiring this job out. All you have to do is to negotiate the quote and sit back, relax, and wait for the PCBs to be delivered to you. 4. Eliminate Design Flaws Design engineers hired by PCB manufacturing and assembling companies use the best graphic software to develop and test the schematics of PCBs. This increases the chances of eliminating flaws in the printed circuit boards during the initial design phase. 5. Multilayer PCB Manufacturing and Assembly The process of manufacturing and assembling multilayer PCBs is as intricate as it sounds. All processes of manufacturing and assembling multilayer PCBs require the best machines and trained technicians to pass the quality and functionality tests. Manufacturing and assembling multilayer printed circuit boards yourself is going to cost you a lot. Even the smallest of mistakes during the manufacturing and assembling process might render the entire PCB entirely useless. 6. Save Time PCBs are just a single part of the electronic device. To complete the device, many more pieces would be needed. The manufacturers of the electronic device can hire out the job of manufacturing or assembling the PCBs, which will mean they will have one less chore to do. This, in turn, will save you a lot of time which could be spent on elevating the quality of the product. 7. Experience Experience makes all the difference. It is what makes the name of any company reliable in the market. Long experience of manufacturing and assembling printed circuit boards makes the company well versed in the process and it also makes it an expert to identify design, manufacturing, assembling, and testing needs of certain applications We, at Asia Pacific Circuits, offer these benefits and so much more. For quick turn PCB assembly, PCB manufacturing and PCB designing, you can contact us anytime.
| 1 |
winsouce.jpg)
.gif)
