Technical Library | 2019-06-03 21:07:34.0
The objective of this White Paper is to provide users of the above products in the electronics industry a clear understanding of the different types of stencil cleaning paper/fabrics that are currently available. Fine pitch applications are more the norm now and so the performance of stencil cleaning rolls is more critical than ever before. This White Paper will give solder paste stencil printing engineers and purchasing professionals an insight into the main products on the market, thereby enabling them to make informed decisions.
Technical Library | 2021-12-06 03:43:31.0
By potting under vacuum, components can be optimally protected from external influences. Before the potting process, air and moisture are removed from the components by vacuum. Components with geometries that are difficult to vent, coils, transformers or wound goods can be potting free of air bubbles. Potting under vacuum guarantees an even distribution of the potting material.Whatsapp 0086 134 2516 4065
Technical Library | 2014-10-27 08:54:59.0
A lot of time and effort often goes into finding the right equipment for your facility. Purchasing a new wire cut & strip machine is no different. With so many options, where does one start? Asking these five questions during the decision making process will help ensure you end up with equipment that fits all of your needs.
Technical Library | 2016-11-30 15:53:15.0
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.
Technical Library | 2019-05-21 00:21:26.0
Continue to talk about the dust removal from temperature humidity test chamber. Cleaning and maintenance: 1) Pls remove internal impurities inisde chamber before operation. 2) The power distribution room should be cleaned at least once a year, and the dust can be removed by vacuum cleaner. 3) The exterior chamber must also be cleaned more than once a year, which can be wiped with soapy water. Inspection and maintenance of humidifier: The water storage in humidifier should be replaced once a month to ensure clean water quality, humidifying water tray should be cleaned once a month to ensure smooth flow of water. The inspection of over-temperature protector:during the test: If the temperature is over 20 ℃ ~ 30 ℃ than the maximum value setted,the power supply of the heater will stop, the "OVERHEAT" overt-emperature warning light will automatically turn on but the fan is still in operation, if the equipment runs without operator around,the operator should check the over-temperature protector in advance to ensure wether it has been setted properly before start [wet ball over-temperature protector set to 120 ℃].
Technical Library | 1999-08-09 11:36:27.0
Shrinking process technologies and increasing design sizes continually challenge design methodologies and EDA tools to develop at an ever-increasing rate. Before the complexities of deep submicron (DSM), gate and transistor delays dominated interconnect delays, and enabled simplified design methodologies that could focus on device analysis. The advent of DSM processes is changing all of this, invalidating assumptions and approximations that existing design methodologies are based upon, and forcing design teams to re-tool. High-capacity parasitic extraction tools are now critical for successful design tape-outs.
Technical Library | 2015-06-22 18:31:52.0
Applying conformal coatings to electronics has come a long way since the days of manually coating circuit boards. The extreme accuracy and highly repetitive process of automated conformal coatings is moving the electronics industry towards a more defect-free era for conformal coating. It enables new forms of electronics to become better protected, making it possible for electronics to withstand harsher environments than ever before. The following article is meant to aid in clarifying the advantages of specialty coating systems over manual applications for selective conformal coating.
Technical Library | 2016-08-04 14:33:23.0
Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen printing is the under stencil cleaning process and one of the key materials in this process is the cleaning paper1. This, often neglected, material affects the cleaning process and thereby also the print quality. It is therefore important to perform tests of different cleaning papers before one could be chosen. This article describes how cleaning papers can be tested and it also tells how big differences it can be between different materials.
Technical Library | 2013-04-12 07:31:31.0
As change is inevitable, therefore so is obsolescence. In the electronics sector, stocks of components used in subassemblies will eventually run out, no surprise there! However on many occasions, particularly in the often long product life cycles associated with the traditional UK OEM’s in the industrial, military and medical sectors, to name but three, component supply gets ‘difficult’ long before the customers products themselves reach their ‘end of life’. Component manufacturers work to a commercial agenda; when the popularity of a specific device wanes, or indeed when new features are demanded by the market, they will cease production and redeploy their manufacturing capacity to devices that are being demanded by their high volume customers; the global players.
Technical Library | 2013-08-22 14:28:58.0
Tin-rich solders are widely applied in the electronic industry in the majority of modern printed circuit boards (PCBs). Because the use of lead-tin solders has been banned in the European Union since 2006, the problem of the bridging of adjacent conductors due to tin whisker growth (limited before by the addition of Pb) has been reborn. In this study tin alloys soldered on glass-epoxy laminate (typically used for PCBs) are considered. Scanning ion microscopy with Focused Ion Beam (FIB) system and energy-dispersive X-ray spectroscopy (EDXS) were used to determine correlations between spatial non-uniformities of the glass-epoxy laminate, the distribution of intermetallic compounds and whisker growth.
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