Technical Library | 2023-12-01 11:08:12.0
Choosing the Right Model I.C.T SMT Coating Machine In the realm of SMT Coating Machine, I.C.T offers an extensive array of advanced models tailored to diverse production needs. The choice of the right machine significantly influences the efficiency and precision of your conformal coating process. This article will provide an in-depth exploration of I.C.T's PCB conformal coating spray machine models, specifically the I.C.T-T550, I.C.T-T550U, I.C.T-T600, and I.C.T-T650, assisting you in making an informed decision aligned with your specific requirements. I.C.T PCB Conformal Coating Spray Machines Overview I.C.T, renowned for its commitment to innovation, quality, and safety, ensures all models hold CE certification. Let's delve into the key distinctions between these models and the essential factors to consider when selecting the ideal machine for your needs. I.C.T-T550: Precision in Simplicity The I.C.T-T550 SMT Coating Machine model features two critical valves: the atomization valve and the precision valve. If you're interested in exploring a variety of coating valves, simply click here for more information. Ideal for applications where fixed valves suffice, the I.C.T-T550, lacking rotation or tilting capabilities, ensures consistent and reliable results for straightforward conformal coating requirements. I.C.T-T550U: Unleash Flexibility For those requiring more versatility, the I.C.T-T550U SMT Coating Machine model is designed to meet your needs. The addition of a rotating U-axis empowers the valves to rotate a full 360 degrees and tilt up to 35 degrees, enabling precise coating in challenging, intricate areas. The I.C.T-T550U's flexibility makes it an excellent choice for a wide range of applications. I.C.T-T600: Doubling Efficiency Closely resembling the I.C.T-T550 SMT Coating Machine, the I.C.T-T600 boasts a unique feature – equipped with two atomization valves. This dual-valve setup enables simultaneous coating of two PCBs, effectively doubling production efficiency. Ideal for applications prioritizing speed and efficiency, the I.C.T-T600 SMT Coating Machine streamlines the coating process. I.C.T-T650: Versatility Redefined In cases requiring different valves for comprehensive coating, the I.C.T-T650 SMT Coating Machine is the solution. This model features two atomization valves and two precision valves, offering exceptional flexibility for diverse conformal coating applications. The I.C.T-T650 SMT Coating Machine ensures precise and reliable results for even the most complex coating needs. Conclusion: PCB Conformal Coating Spray Machines Selecting the right I.C.T PCB conformal coating spray machine is crucial for enhancing the efficiency and effectiveness of your production process. Consider factors such as the size, complexity, and coating requirements of your PCBAs. Rest assured, I.C.T's unwavering commitment to innovation, quality, and safety guarantees the perfect solution to elevate your conformal coating endeavors. If you need further guidance or wish to tap into the expertise of I.C.T professional engineers for designing a customized coating production line, do not hesitate to reach out. We are here to help you achieve optimal results while meeting European safety standards. If uncertain about whether your product requires a PCB dispensing machine or coating machine, feel free to reach out directly or click here to read our comprehensive guide for further insights: Differences Between Coating & Dispensing.
Technical Library | 2013-10-22 07:38:42.0
In conformal coating many components and printed circuit board locations must remain uncoated due to the insulating nature of the coating. The purpose of the conformal coating masking materials is to prevent migration of the conformal coatings into components that need to clear and designated keep out areas. This applies to both liquid conformal coating and Parylene processing. Get this basic process wrong and it can be a big problem, leading to the next stage of either repairing the conformal coating leak, stripping the conformal coating off the circuit board, removing a component to replace it or scrapping the board. This paper reviews typical masking application methods in conformal coating and provides advice on minimising problems.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
Technical Library | 2017-12-11 22:31:06.0
Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.
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