Technical Library: half.a (Page 1 of 1)

Laser Solder Reflow: A Process Solution Part I

Technical Library | 2007-09-06 11:03:33.0

EFD Inc. and Leister USA have collaborated to bust the myth that you cannot perform laser reflow with solder paste. Using Leister diode lasers, EFD has formulated solder pastes that survive the rapid reflow cycle typical of laser heating. These solder pastes reflow and wet well, without spatter, even when heating is accomplished in less than half a second. The flux core in wire solders cannot boast such flux spatter resistance in such an aggressive heating environment.

Nordson EFD

Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers

Technical Library | 2010-09-23 18:22:39.0

If you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed (maybe in scared whispered tones). Tin whiskers certainly aren't a new problem. In fact, some of the first published reports of the occurrence date back to the 1940’s and 1950's. But, over half a century later, we're still talking about it.

Henkel Electronic Materials

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