Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
Technical Library | 2005-05-16 12:09:02.0
Low cost techniques for building prototype and low volume SMT printed circuit boards.
Technical Library | 2020-05-26 22:28:56.0
Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large multi-die System-in-Package (SiP) BGAs with 60-70 mm side lengths and thousands of I/Os.
Technical Library | 2016-01-12 11:05:28.0
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield, eliminate the head-in-pillow effect, and enhance rework yield. However, Sn/Bi alloy is not strong enough to replace lead-free (SAC) and eutectic Sn/Pb alloys in most applications. In order to improve the strength of Sn/Bi solder joints, enhance mechanical performance, and improve reliability properties such as thermal cycling performance of soldered electronic devices, YINCAE has developed a low temperature solder joint encapsulant for Sn/Bi soldering applications. This low temperature solder joint encapsulant can be dipped, dispensed, or printed. After reflow with Sn/Bi solder paste or alloy, solder joint encapsulant encapsulates the solder joint. As a result, the strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved. All details will be discussed in this paper.
Technical Library | 2008-12-18 01:34:49.0
Unless you've been living under a rock the past several years, you are no doubt keenly aware of the global drive toward alternative energy sources. Certainly this initiative is attractive because of the clear environmental benefits of developing fossil fuel substitutes, but also because of potential economic benefit. Although fuel cell technology has been proven viable for various applications, the production costs still remain relatively high, and further process development to promote low-cost, high-volume manufacturing is required to reach a price point that encourages widespread consumer acceptance.
Technical Library | 2015-02-05 23:23:40.0
Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today's high pin count, high frequency integrated circuits. However, that same pin density and unique interface create a challenge unique unto themselves. These challenges need to be faced head on since the ball grid array (BGA) is prevalent in modern PCBs. While there are entire textbooks that cover the topic of BGAs, their use and fanout techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs.
Technical Library | 2021-08-25 16:34:37.0
As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost completely transitioned to the lead-free solder alloys. The conventional SAC305 solder alloy used in lead-free electronic assembly has a high melting and processing temperature with a typical peak reflow temperature of 245ºC which is almost 30ºC higher than traditional eutectic SnPb reflow profile. Some of the drawbacks of this high melting and processing temperatures are yield loss due to component warpage which has an impact on solder joint formation like bridging, open defects, head on pillow.
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
Technical Library | 2019-11-20 22:44:25.0
Salt spray test chamber is used to test teh salt corrosion resistance ability of hardware, metal and other auto parts,the chamber can quickly detect the corrosion resistance degree of products in the temperature, humidity and salt spraying environment, which can effectively improve production efficiency. So what is the reason why such a salt spray test chamber does not spray? As per our past maintenance experience,there are below reasons,customers can have a look,hope it is helpful: 1, the spray tower is blocked; 2, water pipes clogged, water flow can not go in; 3, the air compressor stops running,pls open the air compressor button; 4, main switch of the air compressor outlet is not turned on,pls turn on. 5, the solenoid valve fails, the pressure meter is broken or the pressure is too low, pls check with Climatest and repair it. 6, when the nozzle is clogged, the nozzle should be carefully removed and cleaned,because it is fragile. 7, if the spray pressure is normal, the position of the nozzle glass is also correct, but what is the reason for not spraying? In this case, it is necessary to carefully observe whether there is dirt at the contact surface of the nozzle. If so, clean up the dirt and the spray can be carried out normally. That‘s all we‘re going to talk about today. If you have any questions, follow us on facebook, Please feel free to ask us questions.
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