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Organic Flip Chip Packages for Use in Military and Aerospace Applications

Technical Library | 2006-11-14 12:48:31.0

Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package

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