Technical Library: parts' (Page 3 of 16)

Methods Used In The Detection Of Counterfeit Electronic Components

Technical Library | 2022-10-04 16:43:10.0

In this paper I will discuss the different methods and equipment used to detect counterfeit electronic parts, specifically integrated circuits as well as demonstrate some of the "red flags" that help to identify a part as being suspected counterfeit. We will begin with the initial receipt of the parts and the examination of the outer packaging, the basic visual inspection of the parts, the visual inspection and documentation at high magnification, permanency marking, blacktop test, scrape test, XRF (RoHS), decapsulation, X-ray, basic electrical testing, C-SAM, full function testing and limited function testing.

Electro-Comp Tape and Reel Services, LLC

00341941S01 SMT Spare Parts Oben Stripping Device Plate 12*16mm Feeder

Technical Library | 2022-10-31 09:18:09.0

Model: STRIPPING DEVICE PLATE Type: High-speed Chip Mounter Brand: SIEMENS SIPLACE ASM QUALITY: 100% Tested Usage: SIPLACE SMT Placement Machine HIGH LIGHT: Surface Mount Components, Smt Machine Part High Light: 00341941S01 SMT Spare Parts, 12*16mm SMT Spare Parts, 00341941S01

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

00338005-01 SMT Spare Parts Snap Switch Changer S 826B For Siemens Pick And Place Machine

Technical Library | 2022-10-31 10:18:24.0

Model: IENENS PL EA Servo Motor Usage: Siemens Pick And Place Machine Description: Drive Module SERVO Wight: 2kg Packing: Paper Case Product Description: Motor High Light: 00338005-01 SMT Spare Parts, Snap Switch Changer SMT Spare Parts, SIEMENS Spare Parts Snap Switch Changer

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Adhesive Bonding Instead Of Welding Or Bolting

Technical Library | 2019-05-01 10:07:37.0

Adhesive bonding involves the use of adhesive to form a material bond between two or more assembly parts. In addition to regular adhesive bonding applications, hybrid processes, in which the adhesive bond includes another function such as sealing or heat dissipation, are gaining importance. Traditional joining methods such as welding or bolting are progressively being replaced in industrial applications by efficient adhesive bonding processes, since these processes provide a number of advantages such as part weight reduction or simplified parts handling.

Scheugenpflug Inc.

Advanced Physical Inspection Methods for Counterfeit IC Detection

Technical Library | 2021-10-12 18:05:09.0

The remarkable increase in counterfeit parts (a factor of 4 since 2009) [1] is a huge reliability and security concern in various industries ranging from automotive electronics to sensitive military applications increasing the possibility of premature failure in critical systems [2-5]. Counterfeit parts can also incur a great financial loss to legitimate electronics companies [6]. The issue is even more alarming as the counterfeiters use more sophisticated methods making counterfeit detection a much harder task [7-8]. Therefore, it is reasonable to develop more advanced counterfeit detection methods targeting a more efficient detection of sophisticated counterfeited parts.

University of Connecticut

Dummy Components Part Numbering System

Technical Library | 2000-11-13 20:45:03.0

Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips.

TopLine Dummy Components

PCB Assembly With Obsolete Parts and Hard-To-Find Components

Technical Library | 2018-03-13 14:12:34.0

Many companies take their supply chain for granted until they need an obsolete part or a hard-to-find component. Then the importance of having resourceful contract manufacturing partners becomes an incredibly valuable asset.

Power Design Services

Thermal Management of Electrolytic Capacitors

Technical Library | 1999-05-06 12:08:08.0

Input voltage capacitors are typically the parts that fail first in a high power circuit. Today's requirements for increasingly smaller packages is driving high component densities in power systems, as in all systems. As the package size...

Aavid Thermalloy, LLC

Guide for the Design of Semiconductor Equipment to Meet Voltage Sag Immunity Standards

Technical Library | 1999-08-05 09:51:47.0

This document summarizes the finding of testing to determine the immunity of semiconductor equipment to voltage sag events. Based in part on the findings, global standards have been adopted to define voltage sag immunity requirements for semiconductor equipment...

SEMATECH

THT in-line Inspection: Contradiction or greater Efficiency?

Technical Library | 2010-07-22 18:10:17.0

The utilisation of Automated Optical Inspection systems has become an integral part in quality assurance of electronic assemblies. Depending on batch size and product mixture, AOI systems as Inline integration or as a stand-alone solution benefit efficien

GOEPEL Electronic


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