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Reliability of BGA Solder Joints after Re-Balling Process

Technical Library | 2012-10-04 18:52:43.0

First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t

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