Technical Library: s & 0 (Page 2 of 4)

Laser Drilling as an Alternative for Via & Microvia Drilling

Technical Library | 2024-05-16 16:06:24.0

Much like actual cities where streets and roads connect buildings together, ICs on a board are connected to each other with copper traces. And just like any metropolitan city, urban expansion tends to move vertically instead of horizontally, but instead of multi-story buildings, we get multilayer boards. Vias are copper-plated holes spanning through the different layers of a given board or panel. They are the entrance locations to the subway stations, if you will. Having those multilayer boards has enabled electronic design to minimize the size of boards immensely without compromising on the complexity.

A-Laser, Inc.

Air purification and occupational health & safety in electronics production

Technical Library | 2021-04-16 05:38:38.0

The overall process of manufacturing electronics assemblies is characterized by a number of very different procedures. Along the production chain, technologies for cutting, assembling, soldering, bonding, gluing, marking, potting, etc. are used, all of them have one thing in common: They produce airborne pollutants, some of which can have a significant impact on employees, manufacturing equipment and products - and for this reason need to be removed effectively and efficiently.

ULT Canada Sales Incorporated

Keeping Tin Solderable

Technical Library | 1999-05-06 15:31:13.0

Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself...

TE Connectivity

SMT MLCC&SMD resistance parameters and detailed explanation

Technical Library | 2022-04-28 06:42:19.0

I. Chip capacitors(MLCC) The full name of chip capacitors: multilayer (multilayer, laminated) chip ceramic capacitors, also known as chip capacitors, chip capacitance.

Leaderway Industrial Co.,Ltd

Design, Development & Analysis of Vacuum Chamber of Potting Machine

Technical Library | 2021-08-11 00:57:57.0

This paper shows the Design and Finite Element analysis of vacuum chamber of potting machine designed for electronic ignition coil applications. There are two types of potting methods 1) With Vacuum 2) Without Vacuum.

D Y Patil College Of Engineering Akurdi, Pune

Test Fixture Design Presentation ICT & FCT Test Fixtures

Technical Library | 2021-05-20 13:55:14.0

Quality Control is essential in production processes. In the PCB Assembly process there are several Quality Control steps or options. The most popular tests are the electrical (In-Circuit or ICT) and the function (functional or FCT/FVT) test. ICT test fixtures are standardized and there are several major test platforms available which are industry standards. For FCT applications there are many more variations possible due to the vast number of testers and interface approaches unique to each customer; also due to an endless list of applications which fall under the category of Functional Test (RF, High Current, LED test, Leak test etc.) Test Probes are a very important part in ICT as well as in FCT applications. If the wrong test probe (type, spring force, tip style etc.) is used, the test fixture will not work as intended. In addition the test probe must be installed correctly in order to work properly. This presentation will show general information and some guidelines for a proper Test Fixture design to assure the most efficient production.

INGUN Pruefmittelbau GmbH

00345186 27856240 0020 5283 pick and place parts L&A Ea Mch Fuehrungswagen Kwve

Technical Library | 2022-10-31 09:05:54.0

Warranty: 3 Months Precision: High Precision Certification: CE,ROHS Wight: 1kg Automatic Grade: Automatic Trademark: Ultra High-speed Chip Mounter High Light: 00345186, 00345186 smt pick and place parts, 00345186 SMT Spare Parts

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Material & Process Influences on Conductive Anodic Filamentation (CAF)

Technical Library | 2023-03-16 19:07:51.0

HISTORY: * In the late 1970s an abrupt unpredictable loss of insulation resistance was observed in PCBs, which were subject to hostile climatic conditions of high relative humidity and temperature while having an applied voltage. * The loss of resistance, even leading to a short circuit was observed to be due to the growth of a subsurface filament from the anode to the cathode. * The term "Conductive Anodic Filamentation" (CAF) was coined.

Isola Group

Solder Volumes for Through-Hole Reflow-Compatible Connectors

Technical Library | 1999-05-06 15:36:33.0

The success of surface-mount technology has not meant the end of through-hole connectors. For reasons ranging from availability to user concerns over reliability, through-hole connectors remain widely used.

TE Connectivity


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