Technical Library | 2009-10-29 11:45:52.0
The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to reduce production costs whilst maintaining a consistently high quality level of the manufactured products. Manual repair soldering that is expensive, time-consuming and cost intensive is already unacceptable due to the required quality and the reproducibility of the whole manufacturing process.
Technical Library | 2020-12-16 18:50:42.0
System operating speeds continue to increase as a function of the consumer demand for such technologies as faster Internet connectivity, video on demand, and mobile communications technology. As a result, new high performance PCB substrates have emerged to address signal integrity issues at higher operating frequencies. These are commonly called low Dk and/or low loss (Df) materials. The published "typical" values found on a product data sheet provide limited information, usually a single construction and resin content, and are derived from a wide range of test methods and test sample configurations. A printed circuit board designer or front end application engineer must be aware that making a design decision based on the limited information found on a product data sheet can lead to errors which can delay a product launch or increase the assembled PCB cost. The purpose of this paper is to highlight critical selection factors that go beyond a typical product data sheet and explain how these factors must be considered when selecting materials for high speed applications
Technical Library | 2019-07-02 23:02:05.0
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.This paper will give more detailed information of catalyst systems during development and performance in production lines.
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