Technical Library | 2022-10-31 08:48:31.0
Quality: 100% Tested Precision: High Precision Color: Sliver Transport Package: Wooden Case Specification: HS50 Certification: ISO, CE
Technical Library | 2022-10-31 09:08:50.0
Product Name: ALLIED Vision Technologies GmbH M60S Processing Customization: No Quality: 100% Tested Automatic Manual: Automatic Brand: Siemens AG Custom Processing: Yes High Light: 00344065-03, 00344065-03 Siemens PCB Camera, KST-75-UP Siemens PCB Camera
Technical Library | 2013-12-19 16:57:50.0
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even though military hardware is considered exempt from the requirements of RoHS. As the supply chain has moved to the new lead free alloys both markets are being forced to understand these impacts and form risk mitigation strategies to deal with the change. This paper documents the effect of mixing Leaded and Lead Free alloys on BGA devices and how this impacts reliability. Three of the most common pitch BGA packages are included in the study to determine if the risk is the same as pitches decrease
Technical Library | 2010-02-10 23:50:23.0
The electronics industry has recently undertaken the transition to lead-free processing as a direct consequence of the RoHS directive, which came into force in July 2006. However, this is unlikely to be the last transition required since the European Solvent Emissions Directive, 1999 is starting to be implemented and enforced by national governments. This is resulting in pressure on larger manufacturers, currently emitting more than 5 tonnes of solvent vapour per annum to take steps to limit and reduce their emissions.
Technical Library | 2008-04-29 15:50:45.0
The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfree implementation insures a transition period in which Pbfree and tin/lead solder finishes will be present on printed wiring assemblies
| 1 |
winsouce.jpg)