Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2019-05-29 23:10:30.0
There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.The purpose of the study was to determine the effectiveness of select nanocoating materials as well as certain high end stainless steel stencil materials as they relate to the manual SMT printing process. A variety of nanocoatings were applied to SMT metal stencils and solder paste volume measurements were taken to compare the effectiveness.
Technical Library | 2018-03-07 22:41:05.0
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes 100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.
Technical Library | 2023-05-02 19:16:57.0
1.5 with a 150μm specification window. For 0201 components, the minimum requirement is CpK > 2.0 with a 100μm specification window. The spec window may need to be reduced down to 75μm if the controls for high volume manufacturing are insufficient. Also directly impacting the placement quality is the ability to apply sufficient solder consistently to the board. The goal is to maintain current printing practices, but the effect of powder size will be examined. This paper will evaluate the impact of placement accuracy and solder powder size on 0201 manufacturing quality.
Technical Library | 2023-11-14 19:33:57.0
Wave soldering is an established technology and is commonly used where large unit volumes occur with low product variety. However, if a wave soldering machine is getting old or if technological changes or new PCB designs limits its manufacturing capabilities, consideration should be given to whether selective soldering would be a better choice. Anyone who deals with soldering through-hole and surface mount mixed-technology printed circuit assemblies will quickly discover that a selective soldering machine is not only less expensive that wave soldering, but selective soldering also offers the opportunity to meet customer requirements with significantly more flexibility. One such company is Thomas Preuhs GmbH. Located in Geislingen, Germany, Thomas Preuhs GmbH manufactures a variety of electronic assemblies for solar and HVAC data systems, automotive and white goods products as well as electric drive systems.
Technical Library | 1999-07-21 09:04:04.0
A high volume manufacturer of printed circuit boards (PCBs) had attempted for many years to locate an adhesive that was robust enough to meet their manufacturing needs. This proved to be a challenge because they needed the adhesive to accommodate a wide range of different dispensing equipment and board designs. The two key performance criteria required from the adhesive were dispensability and adhesion...
Technical Library | 2013-06-20 14:33:12.0
With today's consumer technologies driving the need for denser and more compact devices, the assembly process for surface mounted devices has becoming increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are in use in an attempt to ensure consistent and appropriate paste volume is achieved. Some of these techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth wall nickel stencils, through to laser cutting newer grade stencil materials. This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process.
Technical Library | 2016-02-11 18:26:43.0
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.
Technical Library | 2010-06-17 20:48:04.0
The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing processes, solder paste printing is subject to both special and common cause variation. Just like using graduated cylinders from distinctly different manufacturing processes to measure a volume of liquid, using different blades types can contribute significant special cause variation to a process. Understanding the significant differences in print performance between blade types is an important first step to establishing a standard blade for an SMT process.
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