Industry News | 2011-12-30 23:35:59.0
Nihon Superior will issue a new series of guides on “Key Factors in the Selection of Lead-Free Solders.” This series is intended to address the challenges in choosing a reliable lead-free solder. The first guide in the series is titled “Reliability of Lead-Free Solder in Thermal Cycling.”
Industry News | 2016-05-16 16:16:21.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.
Industry News | 2009-03-01 22:13:07.0
OSAKA, JAPAN � February 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces Extra Fine Solder Wire SN100C (030) provides sharp spreading and good separation.
Industry News | 2017-07-06 09:53:39.0
SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2011-07-18 13:19:54.0
BPM Microsystems announces that it will participate in Tekno-Sip’s third annual VIP Seminar, scheduled to take place August 17-18, 2011 in Manaus, Brazil. BPM Microsystems will display its latest generation automated programming system, the model 3800.
Industry News | 2009-03-06 15:54:16.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.
Industry News | 2022-04-27 20:02:32.0
New Yorker Electronics Now Offering New Vishay Ultra Low Capacitance Bidirectional Symmetrical (BiSy) ESD Protection Diodes in Silicon Package
Industry News | 2007-12-05 23:40:50.0
BALVE, GERMANY � December 4, 2007 � The Balver Zinn Group, a leading provider of high-quality anodes with various alloys as well as soft solders and special wires, announces that it is positioning itself to develop the opportunities presented by the global license it has acquired for solder pastes and wire using the proven SN100C alloy developed by Nihon Superior Co. Ltd.
Industry News | 2013-03-01 13:39:03.0
BPM Microsystems announces that Teknosip will display the 3800 automated production programmer in Booth # I78 at the 27th International Electrical, Energy and Automation Industry Fair (FIEE) scheduled to take place April 1-5, 2013 at the Anhembi Exhibition Hall in Brazil.
