Industry News: 0.4 mm pitch bga (Page 3 of 16)

Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing

Industry News | 2009-12-14 20:45:09.0

December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).

Christopher Associates Inc.

Everett Charles Technologies to Attend BiTS Socket Workshop 2009

Industry News | 2009-03-06 14:54:52.0

Everett Charles Technologies will display advanced technologies in booth A44 at the upcoming Bits BGA Socket Workshop, scheduled to take place March 8-11, 2009 at the Hilton Phoenix East/Mesa Hotel Mesa in Arizona.

Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)

GHz Bandwidth Socket for Dual WLCSP

Industry News | 2011-02-26 14:35:16.0

Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.

Ironwood Electronics

Package Converters Enable Testing Generation I product on Generation II System

Industry News | 2010-11-30 13:30:04.0

Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.

Ironwood Electronics

Test Interface Boards – Customers Appreciate Multitest Pulse Plating Process for Board Fab

Industry News | 2012-08-20 13:00:35.0

Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.

Multitest Elektronische Systeme GmbH

Test Interface Boards – Customers Appreciate Multitest Pulse Plating Process for Board Fab

Industry News | 2012-08-20 13:01:17.0

Multitest, announces that its Pulse Plating Process provides significant advantages in terms of fabrication cost and cycle time.

Multitest Elektronische Systeme GmbH

Practical Components to Display Its Latest Products at the IPC APEX EXPO

Industry News | 2013-02-04 14:14:48.0

Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo

Practical Components, Inc.

PNC Inc.’s BGA Assembly

Industry News | 2017-03-23 11:33:40.0

Outline of PNC Inc's BGA assembly capabilities.

PNC Inc.

8 GHz Bandwidth Socket for Intel's ICH6 (I/O Controller Hub 6) BGA Package

Industry News | 2011-04-06 14:07:24.0

Ironwood Electronics has recently introduced a new high performance BGA socket for 1.118mm pitch, 729 pin BGA IC's. The SG-BGA-6345 socket is designed for 31X31 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss.

Ironwood Electronics

ViTrox Technologies Introduces Patented Optical BGA Inspection at SEMICON China

Industry News | 2016-03-07 20:10:00.0

ViTrox Technologies today announced that it will exhibit in Booth #5667 at SEMICON China 2016, scheduled to take place March 15-17, 2016 at Shanghai New International Expo Centre. The highlights of the show will be the TR2000i, VR20 and Vs 3DBGA!

ViTrox Technologies


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