Industry News: 0.4 mm pitch bga (Page 10 of 16)

Practical Components to Exhibit Latest Technologies at MD&M West 2011

Industry News | 2011-01-14 13:00:11.0

Practical Components announces that it will showcase its latest technology at the 2011 MD&M West show in Anaheim, CA from February 8-11, 2011 in booth 2589.

Practical Components, Inc.

NOTE UK leading the way in Package on Package through Siplace technology

Industry News | 2010-06-23 11:36:12.0

Siplace presented a solution to NOTE satisfying their wide ranging needs

Siemens Process Industries and Drives

Multitest’s Gemini™ Contactor Chosen as Standard by Major Semiconductor IDM

Industry News | 2010-08-27 22:49:53.0

Multitest announces that its Gemini™ series contactors have been chosen by another major semiconductor IDM as the contactor of choice for QFN packages. Gemini™ outperformed the competition in multiple categories over months of evaluation.

Multitest Elektronische Systeme GmbH

Multitest’s Q-Tip for Mercury™ Contactor Offers the Best First Pass Yield over the Full Tri-Temp Range

Industry News | 2012-10-22 16:10:06.0

Multitest announces that its Mercury™ contactor with Q-tip successfully passed a two-month evaluation at a US-based IDM with test operations in Southeast Asia with excellent first-pass yield for more than 500k insertions.

Multitest Elektronische Systeme GmbH

25 Percent Cost of Test Improvement – Mercury Contactor Outperforms Competition

Industry News | 2013-11-18 16:32:15.0

Multitest announces that its Mercury 040 Spring Probe Contactor has successfully passed more than five months of evaluation for a strip test application at a SEA high-volume production site.

Multitest Elektronische Systeme GmbH

Practical Components' TMV PoP to Be Featured on Live Assembly Line at NEW 2011

Industry News | 2011-04-07 11:31:09.0

Practical Components announces that its dummy components have been invited to be part of the "Future Proof Assembly Line" at the upcoming National Electronics Week exhibition, which is scheduled to take place April 12-13, 2011 at NEC Birmingham, United Kingdom.

Practical Components, Inc.

Multitest’s Solution for 3D Packages

Industry News | 2013-02-21 07:08:43.0

Multitest, announces that it has been awarded a 2013 NPI Award from Circuits Assembly magazine in the category of Test & Inspection – Functional Test for its InStrip 3D.

Multitest Elektronische Systeme GmbH

FCT Assembly’s NanoSlic® Stencil Coating Recognized for its Electronics Assembly Innovation

Industry News | 2015-11-17 12:24:20.0

November 17, 2015 -- At last week’s Productronica event held in Munich, Germany, FCT Assembly was honored with a Global Technology Award for its new, VOC-free stencil coating, NanoSlic® (www.nanoslic.com). This award win comes on the heels of several successes for NanoSlic, including recent expansion of the company’s licensing network and increased use of the coating technology among global electronics manufacturing firms.

FCT ASSEMBLY, INC.

ESSEMTEC to Highlight a Range of Leading-Edge Technologies at SMT Hybrid Packaging 2013

Industry News | 2013-04-10 11:48:47.0

Essemtec, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

ESSEMTEC AG

Finetech to Highlight Precision Rework and BGA Reball systems at SMTAI 2010

Industry News | 2010-10-01 01:05:06.0

Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Finetech


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