Industry News: 4800 (Page 1 of 3)

The Smart Factory is Becoming a Reality as IPC APEX EXPO 2019 Hosts Two Live Production Lines Collaboration between IPC CFX and HERMES Standards to be highlighted

Industry News | 2018-12-11 19:12:27.0

Creating the next generation of digital Industry 4.0 technology standards, IPC will again take a major step forward at IPC APEX EXPO 2019, featuring two live production lines, at which visitors can see and experience achievements made in digital standards development over the past year.

Association Connecting Electronics Industries (IPC)

BPM Microsystems Adds Model 4800 to its 8th Generation Automated Device Programmer Line

Industry News | 2011-02-21 17:48:47.0

BPM Microsystems announces the addition of the model 4800 to its 8th Generation automated device programmer line. This newest system has the ability to program up to 36 devices in parallel at a rate of up to 1,500 devices per hour, making it the most productive and versatile universal automated device programming system on the market today.

BPM Microsystems, Inc.

Nordson DAGE Receives a Prestigious Global Technology Award for the 4800 Wafer Level Bondtester

Industry News | 2015-11-12 20:18:14.0

Nordson DAGE announces that it was awarded a 2015 Global Technology Award for its 4800 Wafer Level Bondtester. The award was presented to the company during a Tuesday, Nov. 10, 2015 ceremony that took place at the Messe München exhibition center in Munich, Germany during productronica.

Nordson DAGE

Nordson DAGE to Launch New 4800 Wafer Level Bondtester at SEMICON West

Industry News | 2015-06-11 16:18:49.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #5744 at SEMICON West 2015, scheduled to take place July 14-16, 2015 at the Moscone Center in San Francisco. Nordson DAGE will present the 4800 wafer level Bondtester for the first time in North America.

Nordson DAGE

Nordson DAGE’s Complete Solution for Automated On-Wafer Bondtesting Recognized with a Global Technology Award

Industry News | 2018-11-16 19:11:06.0

Nordson DAGE announces that it was awarded a 2018 Global Technology Award in the category of Test Equipment for its 4800 INTEGRA Automatic Wafer Bondtester. The 4800 is the complete solution for automated on wafer bond testing ensuring virtually operator free testing. It is specifically designed for advanced high-density interconnects in both front and back-end applications and utilizes recent advances in operator free technology. The Global Technology Awards recognize and celebrate innovation in electronics manufacturing. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts and the Award was presented to the company during a ceremony that took place during SMTA International.

Nordson DAGE

United Kingdom’s Largest Programming Center Purchases Two 8th Generation Automated Programming Systems

Industry News | 2011-02-23 20:17:14.0

BPM Microsystems, in conjunction with its distributor Adaptsys, announce that Action Circuits (UK) Ltd., the leading programming service provider in the United Kingdom, has chosen two model 4800 automated production programmers to accommodate its increasing programming demands.

BPM Microsystems, Inc.

Quadruple Industry Recognition for Nordson DAGE Test and Inspection systems at Nepcon China 2018

Industry News | 2018-05-02 20:22:07.0

Nordson DAGE announces that it was recognized with four awards for its Test and Inspection systems during Nepcon China, the prestigious global exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation) that brings together all major brands from the electronics manufacturing industry, held in Shanghai 24th – 26th April 2018.

Nordson DAGE

Nordson Showcases Its Market-Leading Test and Inspection Systems at SEMICON West

Industry News | 2017-06-13 20:13:14.0

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce plans to exhibit in Booth #5644 at SEMICON West, scheduled to take place July 11-13, 2017 at the Moscone Center in San Francisco, CA. The Nordson Test & Inspection team will showcase a suite of award-winning systems targeted at both the Semiconductor and PCBA markets, including the Quadra™ 7 X-ray Inspection system, M1m AOI system and 4800 Advanced Wafer Testing Bondtester.

Nordson DAGE

ADLINK to Participate at GPU Technology Conference, Munich 9-11 October, 2018

Industry News | 2018-09-22 20:56:48.0

At this years' GPU technology conference in Munich ADLINK Technology will also demonstrate the latest AI training platform ALPS-4800 plus their M200-JT2 Inference Platform and many more.

ADLINK Technology, Inc.

OrbiTrak� PC/104 GPS Receiver from Parvus Provides Integrated Global Positioning System for Automotive, Marine, and Airborne Embedded Computers

Industry News | 2004-04-22 10:53:51.0

Parvus GPS Module Supports NMEA and Binary GPS Protocols in Vehicle Navigation, Tracking and Telematics Applications

Parvus Corporation

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