Industry News: advent (Page 1 of 3)

Test Protocols for Evaluation of New Lead-Free Alloys Outlined in New White Paper by IPC Solder Products Value Council

Industry News | 2010-06-04 16:23:16.0

BANNOCKBURN, Ill., USA — The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.

Association Connecting Electronics Industries (IPC)

FREE Soldering and Assembly Defects - Causes and Cures Webinar

Industry News | 2010-12-01 14:28:16.0

With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.

Association Connecting Electronics Industries (IPC)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced

Industry News | 2017-07-27 19:01:34.0

The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

FPGAs and Microcontrollers

Industry News | 2018-10-18 10:34:11.0

FPGAs and Microcontrollers

Flason Electronic Co.,limited

J-STD-001 Solder Certification Training Kit Released

Industry News | 2015-06-12 08:33:43.0

BEST Inc has released the new IPC solder certification training kit corresponding to version F. This kit can be used to train in both lead-bearing and lead-free solders and features a "real" PCB.

BEST Inc.

The necessity of X-ray inspection for SMT BGA soldering quality control

Industry News | 2021-06-10 02:42:13.0

With the advent of 5G, especially the high integration, high density, miniaturization of packaging, and high process requirements in the electronics industry, detection efficiency is particularly important. Many manufacturers are not particularly clear about what role X-Ray can play and how to use X-Ray to improve the process and reduce the defect rate. Most manufacturers buy X-Ray because of the needs of customers. Those who are forced to buy X-Ray alone do not actually understand the important role that X-Ray can play in the production line.

Unicomp Technology Co., Ltd

BTU Celebrates 70 Years in 2020

Industry News | 2020-02-01 05:21:42.0

BTU International is celebrating its 70-year anniversary. Since 1950, and with more than 10,000 units shipped, BTU International has been the trusted name for high-tech customers with a need to solve high-volume thermal processing challenges.

BTU International

Join Japan Unix at the IPC APEX EXPO for New Laser Soldering Solutions

Industry News | 2015-01-22 18:25:44.0

Japan Unix will exhibit in Booth #3325 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will address the increasing requirements for soldering and its laser soldering solutions.

Japan Unix Co., Ltd.

KIC's Karl Pfluke to Present during SMTAI Virtual Conference

Industry News | 2020-09-27 04:33:15.0

KIC is pleased to announce that Karl Pfluke, Sales Manager – US/Canada, will present "Automatic Reflow Profiling and Data Analytics" during the SMTA International Virtual Conference & Expo. The Live Virtual Exposition is scheduled to take place Sept. 28-30, 2020 and the On-Demand Conference & Expo will take place Sept. 28-Oct. 23, 2020.

KIC Thermal

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