Industry News: attaching (Page 10 of 82)

Expanding Line of PEM® ReelFast® Surface Mount Fasteners Offers Variety of Reliable Attachment Solutions for Printed Circuit Boards

Industry News | 2016-01-07 09:07:41.0

The expanding line of PEM® ReelFast® surface mount fasteners from PennEngineering® offers a variety of reliable attachment solutions for printed circuit board applications. Depending on type, the fasteners can be specified to mount, stack, or space boards; attach components to boards; create right-angle attachment points on boards; or enable repeated access without requiring loose screws.

PennEngineering

MacDermid Alpha to Promote New ALPHA® Argomax® AccuLam™ Sintering Film and Package Attach Sintering Application at PCIM Europe

Industry News | 2022-05-05 17:43:39.0

MacDermid Alpha Electronics Solutions will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.

MacDermid Alpha Electronics Solutions

X-ray Inspection: High-Contrast|Detector Investigates Non-Conductive Die-Attach

Industry News | 2001-06-05 06:09:32.0

The X-ray inspection of non-conductive die-attach has been not feasible using the customary real time image technique. This has changed now with the launch of the new high-contrast|detector by phoenix|x-ray.

phoenix|x-ray Systems

KIC’s e-Clipse Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:17:30.0

San Diego — November 2009 — KIC announces that it has been awarded a Global Technology Award in the category of Solar Manufacturing Products for its e-Clipse solar cell thermocouple (TC) attachment fixture. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

KIC Thermal

KIC’s e-Clipse Wins a 2010 NPI Award

Industry News | 2010-04-11 02:18:14.0

San Diego - KIC announces that it has been awarded an NPI Award in the category of Process Control Tools for its e-Clipse solar cell thermocouple (TC) attachment fixture. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.

KIC Thermal

YINCAE's DA158N Die Attach Materials withstanding -273°C

Industry News | 2022-03-30 14:59:52.0

YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.

YINCAE Advanced Materials, LLC.

PEM® Fasteners for Printed Circuit Board Applications

Industry News | 2016-10-25 11:49:23.0

Enable Secure and Reliable Attachment Using Minimal Hardware Several dedicated families of PEM® fasteners from PennEngineering® enable secure and reliable attachment for a wide range of printed circuit board applications. Depending on type and style, these fastener solutions can satisfy component-to-board, board-to-board, board-to-chassis, or stacking or spacing attachment challenges. They offer practical alternatives to loose hardware and other joining methods, install permanently without secondary operations, and ultimately can simplify and streamline assembly.

PennEngineering

Henkel Launches High-Lead and Lead-Free Capable Die Attach Solder Paste for Enhanced Thermal Control of Power Devices

Industry News | 2009-07-24 13:38:04.0

To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.

Henkel Electronic Materials

Henkel's New Wafer Backside Coating� Portfolio Revolutionizes Die Attach Processes

Industry News | 2008-08-01 00:29:58.0

With the well-respected die attach brands of Hysol� and Ablestik�, Henkel has long been recognized for consistently pushing the bar higher when it comes to advanced semiconductor materials development. This pioneering philosophy has led to the development of yet another groundbreaking materials advance and the launch of Henkel's Ablestik 8000� Wafer Backside Coating� (WBC) technology.

Henkel Electronic Materials

ECD Launches New Thermosphere BLOG for Electronics Industry

Industry News | 2009-04-09 20:18:51.0

ECD is proud to announce the release of the newest resource for it's customers. ECD Thermosphere will be covering topics from thermocouple attachment to "Wavy Profiles"

Electronic Controls Design Inc. (ECD)


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