Industry News: bga ball bridge (Page 2 of 32)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

IPC’s Revised BGA Guideline Features Expanded Focus on Mechanical Reliability

Industry News | 2013-01-30 17:54:43.0

Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

Association Connecting Electronics Industries (IPC)

Precision PCB Services, Inc. Adds New Line of Rework Products

Industry News | 2010-07-15 14:19:11.0

Now an authorized distributor for Chip Quik products.

Precision PCB Services, Inc

SMTA Releases Free BGA Defect Guide for Download

Industry News | 2019-05-20 18:57:09.0

SMTA recently released the Guide to BGA Assembly & Soldering Defects, a complimentary resource for the electronics manufacturing industry. The book was written by Keith Bryant, industry veteran and Chairman of the SMTA Europe Chapter, and reviewed by members of the SMTA Europe Technical Committee.

Surface Mount Technology Association (SMTA)

How Electronic / Electrical Circuit Works

Industry News | 2018-12-08 03:33:27.0

How Electronic / Electrical Circuit Works

Flason Electronic Co.,limited

Lead-Free (Pb-Free) Solder and Composition

Industry News | 2018-12-08 03:38:44.0

Lead-Free (Pb-Free) Solder and Composition

Flason Electronic Co.,limited

What are the advantages of use nitrogen process for SMT reflow oven?

Industry News | 2018-10-18 08:02:28.0

What are the advantages of use nitrogen process for SMT reflow oven?

Flason Electronic Co.,limited

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

SMT Book – Surface Mount Technology Book PDF

Industry News | 2018-12-08 03:15:55.0

SMT Book – Surface Mount Technology Book PDF

Flason Electronic Co.,limited


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