Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
Industry News | 2024-09-30 19:54:13.0
Altus Group has introduced an advanced BGA re-balling solution to address the electronics industry's growing focus on sustainability and cost-efficiency. Developed by their pre-eminent supplier, Essemtec, this innovative process offers manufacturers a new approach to component recovery and reuse, aligning with increasing market demands for environmentally conscious practices.
Industry News | 2019-03-03 18:54:54.0
PDR today announced the release of Re-Ball Mode Software now available as part of its award-winning ThermoActive Suite Software Package. This latest feature allows the operator to select the software configuration, temperature management and profile management necessary for the successful completion of BGA re-balling operations when using PDR Systems.
Industry News | 2021-02-09 12:28:27.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities
Industry News | 2021-08-13 08:37:00.0
Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above specified limits. The system can also verify the coating thickness. Defense base customers often require XRF verification testing of components after components have been processed through lead-free to leaded solder alloy exchange for tin mitigation applications. XRF testing may also be required to verify RoHS compliance of components that have been re-balled or re-processed for lead-free applications. In addition to XRF testing, Circuit Technology Center also supports ionic cleanliness testing, X-ray, Acoustic Microscopy, Solderability, and BGA ball shear testing services.
Industry News | 2007-02-28 21:19:00.0
EdmondMarks Technologies is opening a new EMS facility in Neptune, New Jersey.
Industry News | 2021-11-12 04:07:03.0
Circuit Technology Center announces it has released an updated version of its popular Bonding System.
Industry News | 2022-01-24 18:01:46.0
Available component modification services utilizing Hentec/RPS Odyssey RHSD systems include BGA de-balling, gold mitigation, lead tinning and tin whisker mitigation.
Industry News | 2021-05-18 14:19:48.0
Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.
