Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2021-09-30 09:28:41.0
Precision PCB Services, Inc. to Exhibit at the SMTA's Tampa Bay Expo & Tech Forum. Visit us and get information on our over 20 different models of BGA Rework Stations to meet your specific BGA Rework Requirements.
Industry News | 2021-09-30 10:10:33.0
Precision PCB Services, Inc. will be providing information on their line of BGA Rework Stations. From fully self-contained machines with their own internal air and vacuum to Nitrogen Capable Machines and Fully Automated machines.
Industry News | 2024-11-11 18:40:17.0
Precision PCB Services, Inc. will be providing information on their line of BGA Rework Stations. From fully self-contained machines with their own internal air and vacuum to Nitrogen Capable Machines and Fully Automated machines.
Industry News | 2016-12-02 15:47:10.0
BGA Rework Process Implementation
Industry News | 2020-11-18 14:34:48.0
We are excited to announce that we are now an authorized manufacturers representative and distributor for the 3 major BGA Rework Station manufactures in Asia.
Industry News | 2011-08-24 17:13:21.0
The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
Industry News | 2003-04-10 07:58:34.0
The answers that you need to stay competitive in today's market
Industry News | 2003-05-21 08:13:48.0
Two half-day workshops on Thursday during SMTA
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
