Industry News | 2022-03-14 08:20:37.0
SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
Industry News | 2012-01-17 16:27:31.0
Nordson DAGE will introduce X-Plane™ to the U.S. market for the first time in Booth #3208 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.
Industry News | 2012-03-08 21:29:50.0
Nordson DAGE will highlight its new X-Plane™ technology in Stand C7 at the upcoming National Electronics Week (NEW) South Africa, scheduled to take place March 13-14, 2012 at the Sandton Convention Center in Johannesburg.
Industry News | 2012-04-27 13:32:30.0
Nordson DAGE has been awarded a 2012 EM Asia Innovation Award in the category of Test & Measurement/Inspection Systems – AXI for its new X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.
Industry News | 2012-07-02 09:45:46.0
No has been selected as a Best of West finalist for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.rdson DAGE
Industry News | 2012-10-17 11:19:43.0
Nordson DAGE announce that it has been awarded a 2012 Global Technology Award in the category of Software – Production for its X-Plane™ Analysis – Sub Micron X-Ray Inspection System Option.
Industry News | 2014-03-27 11:31:00.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly at the opening ceremony of the IPC APEX Expo on March 25.
Industry News | 2019-05-13 17:42:18.0
SHENMAO America, Inc. introduces PF719-P250, a new solder paste for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.
Industry News | 2002-01-22 14:37:07.0
Glenbrook Technologies has announced the availability of several upgrades to their newly developed X-ray image processing software, GTI-5000. The latest version software (version 1.06) has been upgraded to run in a Windows XT, Windows 2000, or Windows NT environment and perform complex inspection routines required for leading-edge packaging technologies like TBGA's, Super BGA's, DSP's as well as CSP's and microBGA's.
Industry News | 2019-04-01 19:56:55.0
SHENMAO America, Inc. provides a variety of solder paste products for SMT assembly including Tin Lead Solder Paste, Lead-Free Solder Paste, Water-Soluble Solder Paste, Package-on-Package Solder Paste, Low-Temperature Solder Paste, and Halogen-Free Solder Paste.
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