Industry News | 2014-05-22 15:42:29.0
Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.
Industry News | 2014-06-03 13:04:15.0
The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.
Industry News | 2015-09-16 11:03:09.0
ISVI Corp. has announced the official release of its all-new IC-M12S-CXP, a monochrome 12 Megapixel CMOS camera with a CoaXPress CXP6, DIN-4 interface delivering 181fps.
Industry News | 2016-09-30 05:38:43.0
In this newsletter we describe a new method of testing the seal and adhesive quality of a lid encapsulated devices.
Industry News | 2013-06-10 12:32:44.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is pleased to announce that its newly developed camera assist automation system will be exhibited in Booth 5971 at the SEMICON West exhibition scheduled to take place on 9-11th July 2013 in San Francisco, Calif.
Industry News | 2024-11-25 14:37:59.0
NEOTech proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%. This improvement reflects NEOTech's commitment to continuous process enhancement and operational excellence.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2020-12-01 02:54:29.0
MacDermid Alpha Electronics Solutions announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.
Industry News | 2024-10-06 19:41:20.0
NEOTech is excited to announce the recent implementation of an enhanced wire bonding manufacturing process for microelectronics circuit assemblies. This innovative process significantly increases production yields while reducing the production cycle time for each assembly. NEOTech remains committed to continuous improvements, particularly in the manufacturing of extraordinarily high-tech microelectronics products for the nation's leading OEMs in the Aerospace & Defense, Medical Device, and Industrial markets. As part of this commitment, NEOTech has researched, tested, and qualified an advanced wire bonding technique known as Standoff Stitch (SOS), which further reinforces the company's dedication to delivering high-quality, precision-driven solutions.
Industry News | 2014-11-18 18:10:25.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.
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