Industry News: climate control unit (Page 1 of 132)

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

Most Versatile Actuator to Date

Industry News | 2003-04-17 08:15:33.0

In launching the LA35 series, SMAC reckons it has produced an actuator with unrivalled versatility.

SMTnet

New Cost Competitive TCVCXO From Fox

Industry News | 2003-05-05 09:21:23.0

Features a 50% Reduction in Length

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Parlex Corporation Announces Third Quarter/FY2003 Conference Call

Industry News | 2003-05-14 08:22:59.0

All interested parties are invited to participate in Parlex's quarterly teleconference, which will be held on Wednesday, May 14, 2003 at 10:00 AM Eastern Time.

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SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

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parvus Corp. Now Shipping its Biothenticator� PC/104 Biometric Fingerprint Sensor Module for Embedded System User Authentication

Industry News | 2003-03-27 08:15:33.0

Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics

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Pulse Offers Highest Power Density SMT Planar Transformer

Industry News | 2003-01-24 09:07:53.0

For Industrial, Telecom and Datacom Use

SMTnet

CirTran Receives Joint U.S./Canadian Certification

Industry News | 2003-02-25 08:07:11.0

Announced that it received Certification Approval From the United States/Canada Joint Certification Office, Defense Logistics Information Service.

SMTnet

Connectors Handle Up to 54A Safely Onboard

Industry News | 2003-05-19 08:44:19.0

Two new PCB power connectors offer easy high power wiring (up to 54A) with built-in safety features to prevent incorrect connections and resist strong vibration.

SMTnet

International Rectifier Introduces Bi-Directional Dual MOSFET in the FlipFET Package

Industry News | 2003-01-29 13:23:31.0

A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package

SMTnet

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